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Moldflow/C-MOLD Post-Filling + Juncture Losses


Test ID  
G-003

   
Description  
Properties needed to perform a Moldflow mold-filling and packing simulation, incorporating pressure drops in runners and gates, are generated. These include Bagley corrected viscosity vs. shear rate at three temperatures (two in the processing range and one below); thermal properties, and PVT data. The entrance pressure loss (Bagley correction) is applied to the viscosity data; the residual contraction pressure loss is correlated to shear stress. Viscosity and PVT data are fit to Moldflow models.    
Included Tests  
# Test Id Test Name
1x D-020 PVT (Isothermal Heating)
3x R-012 Capillary Rheology with Bagley Correction (1 Temperature)
1x R-018 No-Flow Temperature
1x T-015 Specific Heat
1x T-103 Thermal Conductivity Scan
 
Options  
More advanced TestPaks are available to simulate shrinkage and warpage.  
Data  
Moldflow .udb data files and accompanying material property data are provided. You can also create udb files as well as exports for other injection molding CAE using your Matereality CAE Modeler software.  
Samples  
1 - kg of pellets [details]
1 - parts, any shape [details]
   
Application  
In addition to all the software capabilities using Filling data, this TestPak enables the juncture loss calculation which permits the simulation of pressure drop across runners and gates due to extensional effects.