PlanetsX Flow / Pack / Cool / Warp (Thermoplastic Resin)
Test ID
G-271
Description
Tests to generate properties required to perform a flow, packing, cooling, and warpage simulation in the PlanetsX software are included in this TestPak. This testing includes: capillary rheology at three temperatures, specific heat and transition analysis, transient thermal conductivity scan, an isothermal PVT (pressure, volume, and temperature) scan, modulus and Poisson ratio at five temperatures, and an isotropic CTE test.
Included Tests
| 1x | M-101T | SIGMASOFT Mechanical Test |
| 1x | D-020 | PVT (Isothermal Heating) |
| 1x | R-011 | Capillary Rheology (1 Temperature) |
| 1x | T-303 | Thermal Expansion Coefficient by TMA |
| 1x | T-015 | Specific Heat |
| 1x | T-103 | Thermal Conductivity Scan |
Options
Samples
: 2 kg of pellets
[details]: 1 parts, any shape
[details]: 5 plaques (4 x 12in)
[details]Application
This data is used to perform the simulation of a resin flowing into the mold and having packing pressure applied, then cooling of the resin inside the mold. Also included in this TestPak are the properties required to simulate the warpage of the part when ejected from the mold.
