Moldflow Thermoset
Test ID
G-010
Description
Testing required to generate a Moldflow .20030udb file. This testing includes three temperatures of parallel plate rheology, three rates of curing viscosity as well as specific heat, thermal conductivity, density of cured and un-cured material. In addition mechanical properties, thermal expansion and two pressures of isobaric pvt are included. Please note that BMC and RIM materials are not currently possible to test.
Included Tests
| 2x | D-010 | Solid Density |
| 1x | R-022 | DMA Parallel Plate Dynamic Rheology (3 Temperatures) |
| 2x | D-027 | Volumetric Cure Shrinkage |
| 3x | R-028 | Cure Kinetics by DMA -non isothermal |
| 1x | M-101 | Poisson’s Ratio and Tensile Modulus |
| 1x | T-303 | Thermal Expansion Coefficient by TMA |
| 1x | T-015 | Specific Heat |
| 1x | T-108 | Thermal Conductivity by Guarded Heat Flow Meter (Scan) |
| 1x | SP-105 | Specimen Machining Services |
| 1x | Z-998 | Data Analysis (Injection molding) |
Options
Samples
: 1 contact us
[details]Application
Used to characterize materials that cure during the molding process. Due to the wide range of curable materials it may or may not be possible to test all materials. The lab will advise if a specific type of material is not possible to characterize.
