DIGIMAT MX Warpage (Thermomechanic)
Test ID
G-176
Description
This TestPak provides data input for DIGIMAT MX reverse engineeering. Tensile modulus and Poisson's ratio are measured on composite specimens cut out in 0°, 45°, and 90° directions. Tensile modulus and Poisson's ratio are also measured at three additional temperatures between -40°C and 150°C (one sub-ambient and two elevated) on a composite specimen cut out in the 0° direction. Thermal expansion is measured in the 0° and 90° directions.
Included Tests
| 1x | M-101 | Poisson’s Ratio and Tensile Modulus |
| 1x | T-302 | Thermal Expansion Coefficient by TMA (Anisotropic) |
Options
-A reverse engineering service is offered to create a DIGIMAT material card [G-176RE]
Samples
: 25 plaques (4 x 12in)
[details]Application
This model is used to describe the temperature dependence of the elastic thermomechanical behavior of the material; practical applications include the study of part warpage which results from differential shrinkage in the material of the molded part caused by molded-in residual stresses. For use in applications in which analysis does not extend beyond the elastic region of a material.
